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This equipment is suitable for FPC manufacturers, offering the choice of offline or semi-automatic modes according to customer demands. With the aid of manual loading and unloading operations or automatic arm loading and unloading operations as well as precise industrial real-time system positioning, it achieves the cutting and forming of coverlay (CVL), flexible circuits (FPC), rigid-flex boards (RF), and thin multilayer boards. It ensures no blackening, no carbon dust, and can meet high precision requirements.
Project | Technology parameters | |
Laser | Light source | UV laser |
| Laser wavelength | 355nm |
| Average power | 15W/30W |
| Pulse width | <10ps |
Processing performance | Galvanometer maximum scanning range | 50*50mm |
| System processing precision (HGTECH condition) | ±20um |
| Compatible board thickness | 0.01-1mm |
| Platform maximum range | 650*550mm |
| Compatible materials | PT\LCP\MPI\PI\Conductive glue\FR-4, etc. |
| Supported document formats | DXF |
Usageenvironment | Power supply | 220V/50Hz |
| Mainframe dimensions | 1500*1700*1650mm |
| Environment requirement | Temperature 15-30°C, humidity <50% |
Procures imported picosecond ultraviolet lasers.
The equipment comes with a laser power monitoring function, which can monitor the stability of the laser system in real time.
The equipment adopts a fully sealed optical path system, which can ensure long-term stable operations of the optical system.
The equipment is equipped with expansion compensation function and has a feature for expansion compensation tightening.
Intelligent system: The equipment can automatically identify work card barcodes, import material numbers for production. It also has an automatic record system for product number production conditions (production time, number and production parameters).
Features reminders for the replacement and maintenance time of consumables.
It is equipped with the cutting time timing function.
