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It can break the efficiency ceiling of laser cutting and upgrade traditional area-array cameras to high precision imported line scan cameras. By performing full automatic laser cutting through a high precision control system and high-speed line scan vision system, the equipment can significantly enhance equipment UPH and product cutting precision and promote leading industry competitiveness.
Laser | Light source | Ultraviolet laser / green laser |
| Laser wavelength | 355nm/532nm |
| Average power | 355nm: 15w/20w/25w/30w |
|
| 532nm: 40w/50w/60W |
Processing performance | Whole machine processing precision: | ±25um |
| Maximum dimension | 400*200mm (customizable) |
| Supported document formats | DXF/GBR |
Use environment conditions | Power supply specification | 220V 50-60HZ/110V 60HZ,32A |
| Environment requirement | Temperature 15-35℃, humidity <65% |
| Whole machine dimensions | 1400 (W) × 1840mm (L) × 1800mm (H) |
High-speed line scan vision system + dual platform cutting system, UPH increased by 300%;
It is equipped with self-developed high-power solid-state green laser, which can significantly enhance cutting efficiency for 1-2mm thick boards;
With optical path system and working platform made of marble, its cutting precision is less than ±25um and the equipment CPK is > 1.67;
With professional cutting vision algorithm, the equipment can be compatible with different board factory material variations to achieve mass production quality control;
