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The equipment is suitable for the PCBA production line and can perform full-automatic laser cutting through a high precision control system and industrial vision system. A newly customized laser with high output efficiency and stability is used to meet the dust-free and deformation-free high precision cutting requirements of PCBA enterprises.
Laser | Light source | Green laser |
Laser wavelength | 532nm | |
Average power |
| |
Processing performance | Whole machine processing precision: | ±0.025mm |
Maximum dimension | 400*330mm | |
Supported document formats | DXF/GBR | |
Usage environment | Power supply specification | 220V/50Hz/2.5KVA |
Environment requirement | Temperature 15-30°C, humidity <50% | |
Whole machine dimensions | 950mm (W) × 1650mm (L) × 1500mm (H) |
Newly customized PCB thick board panel dividing laser can ensure high light output efficiency and stability.
There is no carbonization on the cutting cross-section, so there is no need for secondary processing.
Cutting line speed: 5mm/S
Precision advantage: whole machine processing precision ±0.025mm
Good compatibility: compatible with different types of laser cutting machines, applicable for slices with the size of 50~150mm (length) and 50~300mm (width)
HAZ after cutting: ≤ 0.15mm
Dual lasers and dual cutting heads are available for large format cutting scope (200x300) mm
Foolproof and post-inspection functions can promptly prevent continuous production of defects.
