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Used for the automatic identification and laser marking of scrapped units on carrier board products after the defect inspection process, enabling terminal clients to efficiently and accurately identify them, improving product yield and process efficiency;
Laser equipment can effectively avoid the mistakes, poor mark consistency, and precision issues common in manual marking processes and significantly improve marking efficiency.
Laser: Green laser
Vision system: Line scan camera for high-speed identification and positioning
Sport platform: Dual-axis linear motor platform
Automation: Automatic loading and unloading, automatic board flipping, automatic sorting of defective products
Assistance device: Laser energy monitoring module
System communication: Identify QR codes to retrieve bad board information for laser processing; output MAP document to upload to the system after processing;
Processing dimensions: 25X40mm~120X300mm
Processing thickness scope: 0.05-1.2mm
Whole machine marking precision: ±0.05mm
Marking dimension: ≥0.3mm
Single laser region: ≥150mm
Marking performance: GV value: Solder mask turning white ΔGV>60; gold point turning black <100QR
Code processing dimension: ≥1.2×1.2mm
1. The board flipping mechanism enables double-sided processing of the product.
2. Dual station operation, achieving high-speed processing of IC carrier board defective board marking.
3. Capable of automatically identifying front-end process marks, or directly obtaining mapping document information on scrap board locations for marking.
4. Equipped with an energy monitoring system to ensure the stability of product processing effects.
5. New procedures can be completed within 20 minutes, allowing for rapid product switching.
6. 45-day delivery period
