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Products
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IC Packaging Substrate Large Board Marking Machine

Used for coding within the packaging substrate core board and trans-coding after lamination; be compatible with the panel board Xout marking function


Equipment parameters

Laser: 10W green laser

Vision system: One set of CCD positioning, one set of X-RAY code reading

Sport platform: High precision linear motion module, linear motor, vacuum adsorption platform

Automation: Single workstation automatic loading and unloading, transplanting suction cup

Assistance device: Standard equipped laser processing-specific smoke purifier

Processing dimensions: Length 300㎜~610㎜, width 300~510mm

Adsorption platform dimensions: Length 650mm*width 550mm

Processing thickness scope: 0.04mm~1mm

Whole machine marking precision: ±100um


Equipment features

Integrated Xray code reading + laser processing QR code function, achieving inner layer code coding and inner-outer layer trans coding processing.

Integrated Xray code reading + laser processing QR code function, achieving inner layer code coding and inner-outer layer trans coding processing.

Compatible with panel board appearance inspection after bad board mark function. This machaine can identify bad board locations through mapping document and process. 


Sample display
National sales hotline
400-0000-000