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Used for inspecting various structural and appearance defects, such as solder layers, finished products, etc., on ceramic substrates. It adoptes independently developed automatic loading and unloading and inspection system, which can ensure high inspection precision and fast efficiency.
| Main technical index | Parameters | |
| Conventional parameters | Product inspection | Ceramic copper-clad substrate |
| Product dimensions | ≤145*195mm | |
| Loading and unloading method | Mechanical hand | |
| Equipment performance | Inspection precision | ≤30um |
| Camera | High-resolution industrial camera | |
| Inspection efficiency | ≥300 pieces/H | |
| Defect marking | Laser marking | |
| Inspection defects | Solder residue, open/short circuit, residual copper, scratches, dirt, etching dimension defect, missing copper, delamination/blistering, missing corner/chipping, ceramic color difference, solder mask defect, etc. | |
| Use environment | Power supply specification | AC 220V/50HZ |
| Air source requirement | ≥0.6MPa | |
| Environment requirement | Temperature 15-35°C, humidity requirement <70%, no condensation | |
| Mainframe dimensions L*W*H | 5500x2000x1900mm |
| 1 | Comprehensive defect categories | Utilize multiple sets of high-resolution optical systems and light source combination schemes to effectively inspect various defects. | |
| 2 | High inspection efficiency | Efficiency: over 300 pieces/H, inspection precision ≤30um | |
| 3 | Data exchange | Configured with code reading function; AOI inspection data can be bound with QR code information and can be connected to MES system. | |
| 4 | Defect marking | Integrate laser marking function and automatically mark defective products according to inspection requirements. | |
