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Fully automatic laser panel dividing workstation can be used at the end of the PCBA/advanced packaging production line to conduct automatic laser cutting, inspection, sorting, and unloading operations of products that have completed assembly/packaging. It helps PCBA enterprises in elevating their level of automation and crafting unmanned intelligent factories. Concurrently, the equipment integrates high-power green laser researched and developed by HGTECH independently to boast higher cutting efficiency and superior cutting effects for boards of 1.6-2mm thickness.
Laser | Light source | UV laser / green laser |
| Laser wavelength | 355nm/532nm |
| Average power | 355nm: 15w/20w/25w/30w |
|
| 532nm：40w/50w/60W |
Processing performance | Whole machine processing precision: | ±25um |
| Maximum dimension | 300*200mm (customizable) |
| Supported document formats | DXF/GBR |
Usage environment | Power supply specification | 220V 50-60HZ/110V 60HZ,32A |
| Environment requirement | Temperature 15-35℃, humidity <65% |
| Whole machine dimensions | 1300 (W) × 3100mm (L) × 1850mm (H) |
The equipment can be used in PCBA/advanced packaging production lines to realize fully automatic loading, cutting, inspection, sorting, and unloading operations. The tracks can automatically adjust their track widths.
Modular composition allows clients to flexibly choose automatic loading and unloading modules, inspection modules and sorting modules. The laser system can select a single/double head platform based on processing efficiency requirements.
Precision advantage: The entire machine's cutting precision is ±25um. Its multi-point single-action mini suction cups can achieve precise placement and picking accuracy at high-speed movements and can capture materials of ±0.04mm precision in fast movements of up to 1500mm/s.
Good compatibility: the equipment is capable of carrying special high-power green lasers independently researched and developed and offering excellent cutting efficiency and effects for PCB boards/epoxy composite materials below 2mm thickness.
System integration: Software is independently developed and it can facilitate integration with client-side MES data systems.
