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Ceramic Substrate Cutting Equipment

Developed specifically for the laser cutting, scribing applications of ceramic substrates. It utilizes independently developed automatic loading and unloading and cutting control system,which can achieve high efficiency, high precision automated processing


Equipment parameters
Project Main technical index Parameters
Laser system Laser source CO2/optical fiber/others
Laser wavelength 10600nm/1080nm/others
Average power ≥150W
Equipment performance Processing precision ±0.025mm
Processing range ≤300*250mm
Processing efficiency (underlined) CO2≥150mm/s, optical fiber ≥100mm/s (depending on the material)
Drawing file format DXF
Use environment Power supply specification AC 380V/50HZ
Air source requirement ≥0.6MPa
Environment requirement Temperature 15-35°C, humidity requirement <70%, no condensation
Mainframe dimensions L*W*H Approximately 2000*1850*1850mm


Equipment features
1 Compatible with multiple materials Configure the laser according to ceramic materials; specialize in cutting alumina, aluminum nitride, silicon nitride, and other ceramics. 
2 High cutting precision High precision linear motors and vision positioning, processing precision reaches ±25um
3 Stable cutting quality PSO and intersection point automatic avoidance control system can ensure stable cutting depth and effect of the product. 
4 Simple equipment operation Technical data library is directly accessible, which can allow non-specialized technical personnel to quickly operate batch production. 
5 Multiple methods of processing Manual and automatic processing can be selected and it can be connected to MES system for data exchange. 
6 Security and environmental protection Efficient dust extraction structure and smoke purification system can reduce dust pollution. 


Sample display
National sales hotline
400-0000-000